At the end of April 2026, theAMD EXPO 1.2 begins its deployment phase on the platforms AM5. For the moment, it is not even a “first foot” laid by AMD EXPO 1.2, but rather a “first toe”, because only one manufacturer is launching…:ÂASUSonly on its X870(E) chipset motherboards, and with BIOS bug which are not even added to the product sheets on the official site, but can be downloaded via a message from safedisk on the ROG forum…
An entry through the back door, therefore, but which allows us to take stock of what AMD EXPO 1.2 should bring in terms of new features, while its deployment accelerates in the coming weeks.
AMD EXPO 1.2, we have known since the end of 2025 that it is preparing to arrive, following the changelog of the v8.35 beta version of HWiNFO which provided support. This was then confirmed with the arrival of the final version HWiNFO v8.40, released on January 8, 2026. The first rumors about its new features mainly revolved around CUDIMM support, this recent RAM standard being at the heart of many discussions for over a year now.
It finally makes its debut this AMD EXPO 1.2 and, according to the latest sources as of today, well it ultimately has nothing to do directly with the CUDIMM…
Due to the DRAM shortage, support has also been added for three Chinese module manufacturers: RAMXEED Limited Conexant, Rui Xuan (formerly Rei Zuan) and Fujitsu Synaptics.
That’s all the surprises there are.
— 1usmus 🇺🇦 (@1usmus) April 24, 2026
According to Yuri Bubliy, a well-known name in the world of AMD Ryzen, who is notably at the origin of the development of optimization software such as DRAM Calculator or HYDRA, AMD EXPO 1.2 would therefore not bring anything new for the CUDIMM or the MIRACLEfor the simple reason that they would already be supported by the current AMD EXPO. In fact, it would be at the level of AGESA that we would not yet be really operational on the side of AMD, which would not be in a hurry and would prefer to wait quietly for the arrival of Zen 6. What is being said is that it would currently be possible to operate CUDIMM modules on the current AM5 Zen 5 platform, but only in mode “Bypass.” The problem is that this would ultimately cancel out the benefits of the CUDIMM, by not taking into account its CKD chip. They would have performance equivalent to the usual UDIMM modules, so what’s the point… It is said that it will only be when the Olympic Ridge processors (Zen 6) are launched, with a new salvo of motherboard chipsets to accompany them, that the CUDIMM will be able to show its full potential in AM5.
On the other hand, the MRDIMM would be on the program for AMD EXPO 1.2. This may seem very surprising, because this standard seems clearly oriented towards the professional world and very high capacity and performance strips. Is this just a sign that AMD prefers to have as many strings to its bow as possible, even if it ultimately never gets exploited? Or while the firm really has a project in mind for the future, we will necessarily be fixed at one point or another.
We leave these RAM standards for more concrete things, starting with “Support for module geometry“. To put it simply, AMD EXPO 1.2 should be less rigid than its predecessor when the user uses modules that are not quite designed in the same way, that is to say with different capacities and/or numbers of chips and/or numbers of ranks for example (if you need a refresher on technical terms like “rank”, do not hesitate to consult our H&Understanding…: RAM).
AMD EXPO 1.2 would also take into account more timings in its profiles, with the addition of TOWNS, tRRDS et tWR. A new mode would also be offered: ULL for “Ultra Low Latency”, to aim for ever more extreme performance on high-end strips.
Finally, faced with the shortage of RAM which sometimes pushes us to turn to brands that we would not necessarily have thought of initially, AMD EXPO 1.2 would add support for three additional Chinese manufacturers of strips: RAMXEED Limited Conexant, Rui Xuan (formerly Rei Zuan) and Fujitsu Synaptics.
