AMD’s future high-end X3D is already circulating on HWBOT while its official launch remains set for April 22. The published screenshots show above all an interesting point: the chip was tested with air cooling despite a consumption which exceeds 200 W.
Ryzen 9 9950X3D2 : first relevés on HWBOT
HWBOT reference now a page dedicated to Ryzen 9 9950X3D2presented as AMD’s first mainstream model with dual 3D V-Cache. The processor is not yet marketed, but several results have already been submitted from the same test configuration.
Four results appear in the captures. Under Cinebench 2026 CPU Multi Thread, the chip reaches 9,246 points, with a single-core score of 746. Cinebench R23 Multi Core shows 38,579 points, while the 7-Zip benchmark goes up to 227,919 MIPS.
Platform used and measurements taken
The system seems to be based on an ASUS ROG STRIX B850-A GAMING WIFI motherboard, 32 GB of DDR5-6000 from Kingston, a Radeon RX 7900 XTX and Windows 11 25H2. CPU-Z also indicates a TDP of 200 W, in line with the specifications already published by AMD.
Benchmark overlays show frequencies slightly above 5.19 GHz during Cinebench sessions. The recorded package power increases to 216 W under Cinebench 2026 and 220 W under Cinebench R23. The thermal peak visible on the captures reaches 95 to 96 °C.
Figures still incomplete, but already useful
These results must be taken with caution. The first submissions do not document the BIOS setting, nor the exact cooling, nor the possible power profiles applied by the motherboard. This is an important point on a platform where consumption limits can vary significantly depending on the manufacturer’s presets.
The fact that a copy is already circulating among testers is not surprising less than two weeks before the launch. On the other hand, seeing a multi-threaded score of 38,579 points under Cinebench R23 with air cooling and a temperature around 96 °C already gives a first framework of comparison for the next leaks and especially for the complete tests after embargo.
On this type of dual-cache X3D chip, interest will not be limited to pure CPU benchmarks. The real subject will be the balance between application performance, thermal performance at 200 W and in-game behavior compared to other Ryzen 9000
Source : VideoCardz
